1

概述/如何建立和保持认证课程政策和程序。(Summarize/policy and program)

关于认证课程、证书的期限、参与者的义务、IPC认证培训员、补考的政策等。(About authentication course\ Time limit of the certificate\ The participant’s obligation etc.）

2

前言、可适用文件、操作(Foreword/ Applicable Documents/ Handling Electronic Assemblies)

范围、目的、特殊设计、术语和定义、图例、检查方法、尺寸界定、放大装置和照明、适用文件、IPC文件、电子组件操作等。Scope/ Purpose/ Specialized Designs/ Terms & Definitions/ Examples and Illustrations/ Inspection Methodology/ Verification of Dimensions / Magnification Aid and Lighting/ IPC Documents/ Handling Electronic Assemblies etc. )

3

机械装联(Hardware)

机械零件的安装、连接器、拔插件、手柄和插孔、连接器引脚、线束固定、布线等。(Hardware Installation/ Connectors、Handles、Extractors、Latches/Connector Pins/ Wire Bundle Securing/Routing etc.)

4

焊接和高电压(Soldering/ High Voltage)

焊接的可接受性、高电压以及焊接异常等(Soldering Acceptability Requirements/ Soldering Anomalies/ High Voltage)

5

接线柱的连接(Terminal Connections)

夹簧铆接端、铆接件、导线/引脚准备上锡、引脚成型-应力释放、维修环、应力释放引脚/导线弯曲、引脚/导线的安放、绝缘皮、导体、端子焊接、导体-损伤-焊后的情形等。(Edge Clip/ Swaged Hardware/ Wire/lead Preparation-tinning/Lead Forming-Stress Relief/Service loops/ Terminals-stress Relief lead/Wire Bend/ Lead/Wire Placement / Insulation/ Conductor/Terminals-Solder/ Conductor-Damage-Posit-Solder)

6

通孔连接技术(Through-hole Technology)

元气件安放、散热器、元气件紧固、支撑孔、非支撑孔、跨接线等。

(Component Mounting/ Heat-sinks/ Component Securing / Unsupported Holes / Supported

Holes / Jumper Wires.)

7

表面安装技术 (Surface Mount Assemblies)

胶水粘接、SMT连接（底部焊垫片式元件、1-3-5片式元件、圆拄型、城堡型、鸥翼型引脚、圆形或扁圆型引脚、J型、I型、扁平焊片、高立底部焊垫、内L型、BGA、PQFN等引脚形态）、跳线等。Staking Adh